The all-round conductive sponge is produced by the polymer composite foaming technology, and the foaming aperture is uniform. soft. Flexible. Uniform distribution of non-scumming versatile conductive sponge protects the device pins and is corrosion resistant, making it an ideal dielectric material for long-term storage devices. At the same time, the all-round conductive sponge has a long effective period of conduction, and the all-round conductive sponge is not affected by temperature and humidity, and the surface resistance value can be customized according to the actual use. It is divided into two categories: high density and low density.

High density: used for testing, plug-in integrated circuit, can be used for conductive and antistatic packaging materials with high requirements;

Low density: used for electronic product packaging with anti-shock and anti-static requirements.